Target bonding

Hexon offers PVD sputtering targets bonded by indium or Ag/Sn/Cu alloy at a competitive price comparing US or Europe bonding service company.

According to your specific targets material, Hexon provides different backing plates for your bonding choice:

● OFHC copper backing plate

● Molybdenum backing plate

● Stainless steel backing plate

● Aluminium backing plate

Please contact us to learn more of our bonding service and other details you may interest.