Rotatable Target

Rotatable sputtering targets are primary used in large area coating for various glass, flat panel displays, as well as photovoltaic and power solar industries. Today, more and more magnetron rotatable sputtering targets are used than before, because of its significantly improved benefits, comparing to normal planar targets used in the past:

●  higher utilization (2-2.5 times than planar targets)

●  longer working life which reducing down time frequency and system maintance time (saving relevant charges)

●  high-power allowed, homogeneous heat distribution on the whole surface areas of targets (faster sputtering, better deposition performance)

HEXON is experienced in supplying rotatable sputtering targets, including typically used metals and alloys, by means of different forming technologies.

Rotatable sputtering targets manufacturing methods

●  Extruding

●  Rolling

●  Hot isostatic pressing (HIP)

●  Vacuum sintering

●  Vacuum casting

●  Thermal spraying

●  Forging + boring + lathing & honing

Benefits & features of our rotatable targets

●  Homogeneous microstructure

●  Smaller grain-size

●  High density

●  High purity

●  OD 50 mm to 220 mm, length up to 4000 mm

●  Monolithic configuration or segmented and bonded on base tube

Metals and alloys we can supply for rotatable sputtering targets (A-Z)

●  Aluminum

●  Chromium

●  Copper

●  Indium, In-Sn

●  Molybdenum, Mo-Nb

●  Nickel, Ni-Cr, Ni-V

●  Niobium, NbOx, Nb-Zr

●  Silicon, Si-Al

●  Stainless steel

●  Tantalum, TaOx

●  Titanium, Ti-Al, Ti-Si, TiOx

●  Tungsten

●  Vanadium

●  Zirconium

●  Zinc, Zn-Al, Zn-Sn

Please Contact us if you have a special material requirement for rotatable sputtering targets.