Refractory Metals
Molybdenum Copper (Mo-Cu)
Our molybdenum copper products are manufactured by using a molybdenum skeleton and infiltrating with copper, a wrought powder metallurgy technology (PM). Molybdenum-copper is a composite material. It has similar thermal properties to the tungsten-copper composite, but its lower density makes it more suitable for applications where weight limitations are a factor.
HEXON offers and supplies tailored CTE of molybdenum copper and Cu:Mo:Cu laminates products according to customer’s specific demand and application. Typical technical properties of our molybdenum copper are given as below. If you have other special composite, please inform more details for our engineers to provide innovative solutions to your requirements.
|
Material |
CTE [ppm/K] |
Thermal conductivity [W/(m ·K)] |
Density [g/cm3] |
|
85Mo-15Cu |
7.0 |
160 |
10.0 |
|
80Mo-20Cu |
7.5 |
175 |
9.9 |
|
70Mo-30Cu |
8.3 |
200 |
9.8 |
|
60Mo-40Cu |
10.2 |
222 |
9.6 |
|
50Mo-50Cu |
11.2 |
260 |
9.5 |
|
Cu/Mo/Cu-1:1:1 |
8.8 |
250(x)-305(y) |
9.32 |
|
Cu/Mo/Cu-1:2:1 |
7.8 |
210(x)-260(y) |
9.54 |
|
Cu/Mo/Cu-1:3:1 |
6.8 |
190(x)-240(y) |
9.66 |
|
Cu/Mo/Cu-1:4:1 |
6.0 |
180(x)-220(y) |
9.75 |
|
Cu/MoCu/Mo-1:4:1 |
7.2(x)-9.0(y) |
300(x)-340(y) |
9.4 |
Our available forms
● Sheet and plate
● Rod
● LED wafer
● Heat sink and spreader
● Substrate
● Components according to drawing
Features of our molybdenum copper
● High electrical conductivity
● High thermal conductivity
● Low and tailored coefficient of thermal expansion
● Non-magnetic
● Reduced density over tungsten copper
● Finer particle size
● Critical dimensional tolerance and surface finish
Typical applications
● Electrical contacts for vacuum switch
● Thermal spreader and heat sink for electrical vacuum device
● High power parts for RF/optical communication systems
● Components for instruments
● High temperature components for aerospace and ordnance
