Tungsten Copper Heat Sinks

Copper Tungsten is one of the most popular refractory metal based electrical packaging and heat sink materials due to its high temperature resistance and low coefficient of thermal expansion.

75WCu to 90WCu are typically used for electronic packaging and heat sinks for semiconductor industry because of their compatible thermal expansion with semiconductor materials and ceramics, high melting point, high thermal conductivity and electrical conductivity. 

HEXON supplies tungsten copper by using isostatic pressing, high-temperature sintering and copper infiltration process. We can produce semi-finished forms like plate, sheet, rod, bar, tube, as well as complicated custom-shaped forms by die molding, extrusion or injection molding, in large or very small sizes.

Datasheet for tungsten copper used as heat sinks